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  1. Thermal Paste Kit Cpu Heatsink Grease Compound Computer Components

    200Pcs Laminating Pouches Paper Transfer Tape for Vinyl Film. Heat Sink Heating Dissipation Pads for Ssd Supplies Heatsink Cooler. Related Hot Sale. Thermal conductivity: 8. Clipper Guard Organizer Barber Accessories Limit Comb Storage Box Hair Case.

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  2. 100pcs HY510 30g Thermal Conductive Grease Paste For GPU CPU Chipset Cooling

    Model: HY510. Net Weight: 30g. Low Thermal Resistance And High Conductivity For Superior Heat Transfer. Thermal Conductivity: >1.93 W/m-K. Thermal Resistance: <0.225° C-in²/W.

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  3. Thermal Paste Cpu High Performance Grease Compound Heat Transfer

    Red Crystal Tree Topper Apple Statue Decorative Apples. 8 Pcs Pulley Accessories Cord Locks for Roman Blinds Universal Curtain. Designed for cooling down your computercomponents, this thermal paste is easy to use.

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  4. ARCTIC MX-4 (4 g) - Premium Performance Thermal Paste for All Processors (CPU, G

    This ensures that heat from the CPU/GPU is dissipated quickly & efficiently. - AUTHENTICITY CHECK: Through our Authenticity Check, it is possible to verify the authenticity of every single product. - EASY TO APPLY: With an ideal consistency, the MX-4 is very easy to use, even for beginners.

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  5. Arctic Original MX-4 4g Thermal Paste Compound CPU GPU PS XBOX

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  6. Silicone Compound-Thermal Conductive Grease Paste Heatsink For CPU GPU Cooling ;

    Low thermal resistance and high thermal conductivity. Thermal Resistance: <0.225°C-in2/W. Brush with clean water or send to hospital when necessary. Material: silicone. High conductivity, effective insulation, high temperature resistant, low oil departs non-corrosive.

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  7. 20g Silver Compound Thermal Grease Paste Tool Chipset Cooling For CPU GPU HY710

    Net Weight: 20g. Help disperse the heat from CPU to heatsink effectively. Suitable for: CPU heatsink or chip. High temperature resistance. Thermal Conductivity: >3.17W/m-k. Thermal Resistance: <0.067°C-in2/W.

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  8. Heatsink Thermal Grease Paste Compound CPU Cooler Adhe Glue Silicone O1T9

    1x Heatsink Plaster. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Good thermal conductivity, strong adhesion.

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