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  1. Thermal Paste HY-A9 11W/MK CPU GPU Chipset Graphics Card LED Audio Thermal 3g

    Eine echt gute Wahl! gut zu Dosieren und wiederverschließbar. Sie erreichen uns wie folgt Wichtige technische Daten und sonstige Eigenschaften. Design by DOGENDORF ®. Service & Support. Technische Daten.

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  2. Heatsink Thermal Grease Paste Compound CPU Cooler Silicone Cooling ✨|8 ]/ λ Q7Z6

    1x Heatsink Plaster. Scope of application Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. Good thermal conductivity, strong adhesion.

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  3. Cpu Thermal Heatsink Grease Paste Compound Transfer Computer Components

    DIY Painting Brush Set Children's Paint Kids Paint Tool for Beginner Painting. It has a simple design, but very practical in use,giving you a good using. Designed for cooling down your computercomponents, this thermal paste is easy to use.

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  4. High Performance Thermal Grease Compound Computer Paste Heat Sink CPU

    20 Pcs Drink Coaster Felt Water-absorb Pad Hollow Pattern Coaster Skidproof Pad. Designed for cooling down your computercomponents, this thermal paste is easy to use. Also can be a good gift choice for yourfriends, they will like it.

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  5. HY883 OP2G 6.5W/m-K Silicone Thermal Paste Heat Transfer Silicone Grease

    Thermal conductivity: 6.5W/m-K. Specifications: Component:Silicone Thermal Paste. Optimized heat dispersion in demanding scenario like processors, extended gaming, or intensive multitasking workloads with this advanced thermal material.

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  6. 2 Pack - Arctic Silver 5 3.5G Thermal Compound

    Arctic Silver AS5-3.5G Thermal Compound. Lot of 2

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  7. 10PCS HY510 30g Grey Thermal Conductive Grease Paste For GPU CPU Chipset Cooling

    Model: HY510. Net Weight: 30g. Am 13.01.2026 hat der Verkäufer die folgenden Angaben hinzugefügt Low Thermal Resistance And High Conductivity For Superior Heat Transfer. Thermal Resistance: <0.225° C-in²/W.

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  8. Heatsink Thermal Grease Paste Compound CPU Cooler Glue Adhesive Silicone H6G3

    1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. The filling of the between the high-power transistor and the aluminum.

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