GREASE THML X-23-7783D, 182759-007. Kategorie: Computer, Tablets & Netzwerk - Sonstige. Part Nr.: 390717-001, 182759-007.
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Core i3-560 with sSpec SLBY2. This thermal grease can be used on the rear side of the heatsink which has no thermal pad. It will improve the heat dissipation of your processor. Suitable for the following Processors.
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With its excellent thermal conductivity, Hydronaut can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price / performance ratio for their water cooling system.
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THERMAL PASTE INCLUDED.
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99.995 Pure Indium Thermal Pad 80x80mm square.
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1 x HY-510 Thermal Paste Grease. Widely used in CPU, LED, household appliances and electronic components,etc. Thermal Conductivity Coefficient: 1.93W / MK. Thermal Resistance: 0.225. High thermal conductivity, high insulation and high temperature resistance.
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TG Remove is an acetone based nano-cleaner for the best cleaning results of thermal paste. TG Remove was developed by Thermal Grizzly with the focus on removing thermal paste and residues in the most efficient way.
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Der Fokus lag auf vielseitigen Anwendungsmöglichkeiten und einer einfach zu handhabenden Konsistenz. Wiederverschließbare Spritzen verhindern ein Eintrocknen der Paste und erleichtern das Dosieren. Alternativ sind die Varianten mit MX Cleaner erhältlich.
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